Intel Uses New Foveros 3D Chip-Stacking to Build Core, Atom on Same Silicon

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability.

The post Intel Uses New Foveros 3D Chip-Stacking to Build Core, Atom on Same Silicon appeared first on ExtremeTech.

from ExtremeTechExtremeTech https://www.extremetech.com/computing/282137-intel-uses-new-foveros-3d-chip-stacking-technology-to-build-core-atom-on-the-same-silicon